1. 2. 3. material content data sheet sales product name tlf1963tb issued 28. august 2013 ma# MA000994124 package pg-to263-5-1 weight* 1672.91 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.428 0.26 0.26 2647 2647 leadframe non noble metal iron 7439-89-6 0.483 0.03 289 inorganic material phosphorus 7723-14-0 0.145 0.01 87 non noble metal copper 7440-50-8 482.096 28.82 28.86 288178 288554 wire non noble metal aluminium 7429-90-5 0.258 0.02 0.02 154 154 encapsulation organic material carbon black 1333-86-4 1.455 0.09 869 plastics epoxy resin - 66.908 4.00 39995 inorganic material silicondioxide 60676-86-0 658.898 39.37 43.46 393862 434727 leadfinish non noble metal tin 7440-31-5 12.370 0.74 0.74 7394 7394 plating non noble metal nickel 7440-02-0 0.243 0.01 145 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 145 solder noble metal silver 7440-22-4 0.090 0.01 54 non noble metal tin 7440-31-5 0.072 0.00 43 non noble metal lead 7439-92-1 3.436 0.21 0.22 2054 2151 heatspreader inorganic material phosphorus 7723-14-0 0.133 0.01 79 non noble metal iron 7439-89-6 0.442 0.03 264 non noble metal copper 7440-50-8 441.456 26.39 26.43 263885 264228 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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